Adhesiveless Copper Sputtered Polyimide Films and their Applications to FPCs and TABs.
نویسندگان
چکیده
منابع مشابه
architecture and engineering of nanoscale sculptured thin films and determination of their properties
چکیده ندارد.
15 صفحه اولHydrothermal synthesis of Copper nanoparticles, characterization and their biological applications
We report an ecofriendly novel method for copper nanoparticles (CuNPs) synthesis by hydrothermal processes using an activated carboxymethyl gum of locally available medicinal plant Cochlospermum gossypiumas capping agent. The synthesized CuNPs characterized by Ultraviolet - visible Spectroscopy (UV-Vis), Fourier – transform infrared Spectroscopy (FTIR), and Transmission Electron Micros...
متن کاملHydrothermal synthesis of Copper nanoparticles, characterization and their biological applications
We report an ecofriendly novel method for copper nanoparticles (CuNPs) synthesis by hydrothermal processes using an activated carboxymethyl gum of locally available medicinal plant Cochlospermum gossypiumas capping agent. The synthesized CuNPs characterized by Ultraviolet - visible Spectroscopy (UV-Vis), Fourier – transform infrared Spectroscopy (FTIR), and Transmission Electron Micros...
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Kapton polyimide is known for its high thermal stability, >400 ◦C. Copper sulfide thin films of 75 and 100 nm thickness were coated on DuPont Kapton HN polyimide foils of 25 μm thickness by floating them on a chemical bath containing copper complexes and thiourea. The coated foils were annealed at 150–400 ◦C in nitrogen, converting the coating from CuS to Cu1.8S. The sheet resistance of the ann...
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This review addresses the preparation of antibacterial 2D textile and thin polymer films and 3D surfaces like catheters for applications in hospital and health care facilities. The sputtering of films applying different levels of energy led to the deposition of metal/oxide/composite/films showing differentiated antibacterial kinetics and surface microstructure. The optimization of the film comp...
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ژورنال
عنوان ژورنال: Circuit Technology
سال: 1993
ISSN: 1884-118X,0914-8299
DOI: 10.5104/jiep1986.8.481